Mechanical assembly for regulating the temperature of an electro

Details Mechanical assembly for regulating the temperature of an electro Mechanical assembly for regulating the temperature of an electro

1998-12-10

2000-09-12

Atkinson, Christopher

Heat exchange

With retainer for removable article

Electrical component

165185, 257714, 257718, 361699, F28F 700

Patent

active

061163317

ABSTRACT:
A mechanical assembly for regulating the temperature of an integrated circuit chip is comprised of a frame which has two spaced-apart spring supports. A single leaf spring extends from one of the spring supports to the other. A heat exchanger contacts the leaf spring at one point, pushes the leaf spring against the spring supports, and has a face for mating with the chip. And, a stop is provided between the heat exchanger and the frame, which keeps the heat exchanger on the leaf spring. With this assembly the heat exchanger exerts a very small force at its initial point of contact on the chip; the length of the single leaf spring does not add to the profile of the assembly; no slippage occurs between the heat exchanger and the chip; and, the stop prevents the heat exchanger from twisting and becoming offset relative to the chip.

REFERENCES:
patent: 5166863 (1992-11-01), Shmunis
patent: 5394299 (1995-02-01), Chu et al.
IBM Corp., Alternative Module Package, IBM Technical Disclosure Bulletin, p. 1703, Sep. 1987.
IBM Corp., Device for Conducting Heat From Chips, IBM Technical Disclosure Bulletin, pp. 3660-3661, Jan. 1987.

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