Mechanical assembly, for regulating the temperature of an...

Details Mechanical assembly, for regulating the temperature of an... Mechanical assembly, for regulating the temperature of an...

2008-05-20

2008-05-20

Ciric, Ljiljana (Department: 3744)

Heat exchange

With retainer for removable article

Electrical component

C165S104330

Reexamination Certificate

active

07373967

ABSTRACT:
A mechanical assembly for regulating the temperature of an IC-chip in an IC-module includes: a) a heat-exchanger having a first face for contacting a second face on the IC-module; and b) a gimbal, coupled to the heat-exchanger, for tilting and pressing the first face flatly against the second face, as the first and second faces are moved from a spaced-apart position to an engaged position at which the IC-chip temperature is regulated. In addition, the mechanical assembly further includes an output tube, coupled to an output port on the heat-exchanger, which has two ends that move relative to each other as the first and second faces move from the spaced-apart position to the engaged position; and, this output tube is coiled into a weak spring which is characterized by a stiffness matrix that is limited by a predetermined acceptance criterion.

REFERENCES:
patent: 5420521 (1995-05-01), Jones
patent: 7004240 (2006-02-01), Kroliczek et al.
patent: 2003/0051857 (2003-03-01), Cluzet et al.
patent: 2004/0206479 (2004-10-01), Kroliczek et al.

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