Measuring the shape and thickness variation of a wafer with...

Details Measuring the shape and thickness variation of a wafer with... Measuring the shape and thickness variation of a wafer with...

2008-05-15

2010-12-07

Lyons, Michael A (Department: 2877)

Optics: measuring and testing

By light interference

For dimensional measurement

C356S503000

Reexamination Certificate

active

07847954

ABSTRACT:
A system with two unequal path interferometers, with a first flat, a second flat, and a cavity between the first and second flats, a holder to receive an object in the cavity such that an optical path remains open between the first and second flats, and a motor coupled to the holder such that the object may be tilted in the cavity to allow for measurements of, and a radiation assembly to direct collimated radiation to the interferometer assembly, a collecting assembly to collect radiation received from the interferometer assembly, and a controller comprising logic to; vary a wavelength of the radiation, record interferograms, extract phases of the interferograms to produce phase maps, determine from each map areas with high slopes, tilt the holder to allow measurement of the high slope areas, and process measurement that covers the entire surface of the object.

REFERENCES:
patent: 6480286 (2002-11-01), Kubo et al.
patent: 6594002 (2003-07-01), Drohan et al.
patent: 6847458 (2005-01-01), Freischlad et al.
patent: 6885459 (2005-04-01), Muller
patent: 6925860 (2005-08-01), Poris et al.
patent: 7057741 (2006-06-01), Mueller et al.
patent: 2003/0210404 (2003-11-01), Hill
patent: 2005/0151951 (2005-07-01), Hill
patent: 2008/0068614 (2008-03-01), DeGroot

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