Chemistry: electrical and wave energy – Processes and products
Patent
1987-10-16
1989-03-14
Tung, Ta-Hsung
Chemistry: electrical and wave energy
Processes and products
204434, G01N 2746
Patent
active
048122106
ABSTRACT:
An arrangement for measuring the concentration of surfactants in a electrolyte containing metal ions includes applying a DC bias voltage and a modulated voltage to a counter electrode. The phase angle between the modulated voltage and the current response to the modulated voltage at a working electrode is correlated to the surfactant concentration.
REFERENCES:
patent: 4132605 (1979-01-01), Tench et al.
patent: 4146437 (1979-03-01), O'Keefe
patent: 4246343 (1981-01-01), Wilkins et al.
patent: 4443301 (1984-04-01), Kerby
patent: 4479852 (1984-10-01), Bindra et al.
patent: 4503383 (1985-03-01), Agar et al.
patent: 4541902 (1985-09-01), Kinoshita et al.
patent: 4581121 (1986-04-01), Dailey et al.
patent: 4589958 (1986-05-01), Alexander et al.
patent: 4631116 (1986-12-01), Ludwig
patent: 4707378 (1987-11-01), McBride
Joseph Farmer, "Underpotential Deposition of Copper on Gold and the Effects of Thiourea Studied by AC Impedance", Sandia Report Sand 85-8626, 4/85.
Journal of Electrochemical Science and Technology, vol. 132, No. 11, Nov. 1985, pp. 2640-2648.
Bonivert William D.
Farmer Joseph C.
Hachman John T.
Chafin James H.
Hightower Judson R.
Libman George H.
The United States Department of Energy
Tung Ta-Hsung
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