Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters
Reexamination Certificate
2007-11-06
2007-11-06
Nguyen, Vincent Q. (Department: 2858)
Electricity: measuring and testing
Impedance, admittance or other quantities representative of...
Lumped type parameters
C324S686000, C702S179000
Reexamination Certificate
active
11509245
ABSTRACT:
A method for determining misalignment between two semiconductor dies is described in which signals are transmitted through a first subset of an array of proximity connectors that are proximate to a surface of one of the semiconductor dies and received through a second subset of an array of proximity connectors that are proximate to a surface of the other semiconductor die. A spatial beat frequency is determined from the received signals. This spatial beat frequency corresponds to misalignment-induced aliasing of spatial frequencies associated with the first subset of the array of proximity connectors and the second subset of the array of proximity connectors. The misalignment is then determined using the spatial beat frequency.
REFERENCES:
patent: 4982333 (1991-01-01), Ackerman et al.
patent: 2003/0158701 (2003-08-01), Yasuda et al.
patent: 2005/0253066 (2005-11-01), Watanabe et al.
Chow Alex
Ho Ronald
Hopkins Robert D.
Nguyen Vincent Q.
Park Vaughan & Fleming LLP
Stupp Steven E.
Sun Microsystems Inc
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