Measuring and testing – Vibration – By mechanical waves
Patent
1992-06-18
1995-08-08
Williams, Hezron E.
Measuring and testing
Vibration
By mechanical waves
73 1201, 73602, 73DIG1, G01H 500, G01N 2918
Patent
active
054388724
ABSTRACT:
An apparatus for measuring a thickness of plate material includes a plate material whose thickness is to be measured, a vibration pen to generate a plate wave by applying a vibration to the plate material, a vibration sensor which is disposed at an arbitrary position on the plate material and detects the plate wave which has propagated on the plate material, an extracting circuit to extract different frequency components of the plate wave detected by the vibration sensor, a timer to measure arrival times to the vibration sensor of the signals of the different frequency components extracted by the extracting circuit, and a controller to obtain a thickness of the plate material on the basis of the arrival times measured by the timer and the frequency components corresponding thereto. The extracting circuit is a band pass filter.
REFERENCES:
patent: 4429575 (1984-02-01), Akishika
patent: 5035144 (1991-07-01), Aussel
Kaneko Kiyoshi
Kobayashi Katsuyuki
Tanaka Atsushi
Tokioka Masaki
Yoshimura Yuichiro
Canon Kabushiki Kaisha
Finley Rose M.
Williams Hezron E.
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