Measuring method and apparatus using a lamb wave

Measuring and testing – Vibration – By mechanical waves

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Details

73 1201, 73602, 73DIG1, G01H 500, G01N 2918

Patent

active

054388724

ABSTRACT:
An apparatus for measuring a thickness of plate material includes a plate material whose thickness is to be measured, a vibration pen to generate a plate wave by applying a vibration to the plate material, a vibration sensor which is disposed at an arbitrary position on the plate material and detects the plate wave which has propagated on the plate material, an extracting circuit to extract different frequency components of the plate wave detected by the vibration sensor, a timer to measure arrival times to the vibration sensor of the signals of the different frequency components extracted by the extracting circuit, and a controller to obtain a thickness of the plate material on the basis of the arrival times measured by the timer and the frequency components corresponding thereto. The extracting circuit is a band pass filter.

REFERENCES:
patent: 4429575 (1984-02-01), Akishika
patent: 5035144 (1991-07-01), Aussel

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