Thermal measuring and testing – Temperature measurement – By electrical or magnetic heat sensor
Patent
1989-12-01
1991-10-01
Yasich, Daniel M.
Thermal measuring and testing
Temperature measurement
By electrical or magnetic heat sensor
29739, 324158R, 374 45, 437180, G01K 700, G01K 1300
Patent
active
050528211
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
Tempering processes must be frequently carried out in the manufacture of semiconductor products, for example, semiconductor wafers for electronic components. It is thereby important to exactly monitor the temperature of a semiconductor member during the tempering process and to exactly regulate the temperature curve.
A thermoelement attached on a semiconductor member is disclosed in the publication by P. Baeri et al, "Time Resolved Temperature Measurement of Pulsed Laser Irradiated Germanium By Thin Film Thermocouple" in Applied Physics Letters 45, 398 through 400 (1984). In this arrangement, the heating of germanium laminae that are heated with pulsating laser light is measured. To this purpose, the germanium lamina having an outer bead is placed onto a coaxially arranged bimetal composed of constantan and iron having respective contacting surfaces that are conducted to the outside and held at room temperature.
Japanese application 60/23 00 26 published Nov. 15, 1985 discloses a temperature measuring instrument for an examination means for semiconductors. The purpose of this arrangement is comprised in identifying the condition close to the examination time in that the output of the temperature measuring member in a temperature measuring element having the same shape and the same material as the semiconductor element is connected to a probe of the examination means via a conductive probe and the identified temperature of the temperature measuring element of the thermometer that was connected to the probe is displayed.
The publication by K.A. Carlson, P. Disclafani and I. Osten in IBM Technical Disclosure Bulletin 14, 3227 (1972) discloses a thermoelement that is cemented into the substrate material and whose terminal wires are twisted to form a thicker wire.
The publication by C. L. Eggerding et al in IBM Technical Disclosure Bulletin 21, 4839 (1979) recites a temperature measuring means for a multi-layer ceramic, whereby the thermoelement is composed of two channels arranged in alignment in adjoining layers of the ceramic, these two channels being filled with different metals.
The publication by L. S. Goldmann in IBM Technical Disclosure Bulletin 26, 1985 (1983) recites a temperature measuring probe for measuring a surface temperature, this being composed of a thermoelement bead provided with thermoelement wires in a capsule of foil filled with thermally conductive material.
SUMMARY OF THE INVENTION
It is an object of the invention to specify methods and measuring instruments with which the temperature of a semiconductor member can be exactly and reproducibly determined during a tempering process and to recite methods for the manufacture of such measuring instruments.
The object is inventively achieved by a measuring instrument for determining the temperature of a semiconductor member having a thermoelement composed of a thermoelement sphere and thermoelement wires. The instrument has the thermoelement sphere surrounded on all sides with semiconductor material of which the semiconductor member is composed, and the thermoelement wires lead toward the outside through the semiconductor material. A method for manufacturing such a measuring instrument having a semiconductor member of III-V semiconductor material, comprises the steps of manufacturing a recess in this semiconductor member; introducing the thermoelement sphere into this recess; filling up the recess with a constituent of the III-V semiconductor material; and heating the semiconductor member in an atmosphere containing the other constituent of the III-V semiconductor material, so that this constituent is integrated into the material that fills up the recess. A method for manufacturing a measuring instrument having a semiconductor member composed of a single chemical element, comprises the additional features that a recess is manufactured in this semiconductor member; that the thermoelement sphere is introduced into this recess; and that the recess is filled up by selective deposition of the chemical element from th
REFERENCES:
patent: 3462317 (1969-08-01), Baum et al.
patent: 4047436 (1977-09-01), Barnard et al.
patent: 4571608 (1986-02-01), Johnson
patent: 4590507 (1986-05-01), Capasso et al.
patent: 4689659 (1987-08-01), Watanabe
patent: 4808009 (1989-02-01), Sittler et al.
patent: 4820659 (1989-04-01), Dholakia et al.
patent: 4868979 (1989-09-01), Fukushima et al.
patent: 4924114 (1990-05-01), Ruhle
"Time Resolved Temperature Measurement of Pulsed Laser Irradiated Germanium by Thin Film Thermocouple" by Baeri et al., Appl. Phys. Lett. 45 (4) Aug. 15, 1984, pp. 398-400.
"Dynamic Thermocouple Probe for Slip Chip Joining Furnace" by Carlson et al., IBM Technical Disclosure Bulletin, vol. 14, No. 11, Apr. 1972, p. 3227.
"Thick-Film Thermocouple" by Buharin et al., IBM Technical Bulletin, vol. 20, No. 5, Oct. 1977, p. 1889.
"Internal Temperature Monitoring Apparatus for Multilayer Ceramic Substrates", by Eggerding et al., IBM Technical Bulletin, vol. 21, No. 12, May 1979, p. 4839.
"Probe for Low Contact Force Temperature Measurement" by L. S. Goldman, IBM Technical Bulletin, vol. 26, No. 4, Sep. 1983, p. 1985.
Gisdakis Spyridon
Tews Helmut
Zwicknagl Peter
Siemens Aktiengesellschaft
Yasich Daniel M.
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