Optics: measuring and testing – Dimension – Thickness
Reexamination Certificate
2007-12-14
2008-10-28
Punnoose, Roy M (Department: 2886)
Optics: measuring and testing
Dimension
Thickness
C250S559270
Reexamination Certificate
active
07443517
ABSTRACT:
A measuring instrument for a wafer for measuring the thickness of a wafer held on a chuck table using a laser beam includes a condenser for condensing and irradiating the laser beam on the wafer held on the chuck table, a light reception unit for receiving reflected light of the laser beam irradiated upon the wafer, a convergence light point changing unit for changing the convergence light point of the laser beam, and a control unit for measuring the thickness of the wafer based on a change signal from the convergence light point changing unit and a light reception signal from the light reception unit. The control unit stores a thickness control map. The control unit controls an angle adjustment actuator, provided for adjusting the installation angle of a pair of mirrors, to change the installation angle and detects two peaks of the light amount based on the reception signal from the light reception unit.
REFERENCES:
patent: 2006/0076327 (2006-04-01), Kobayashi et al.
patent: 2007/0243696 (2007-10-01), Kobayashi et al.
patent: 2002-192370 (2002-07-01), None
patent: 2003-163323 (2003-06-01), None
patent: 2006-247674 (2006-09-01), None
Nomaru Keiji
Sawabe Taiki
Disco Corporation
Greer Burns & Crain Ltd.
Punnoose Roy M
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