Measuring apparatus using an ultrasonic wave to provide flaking

Measuring and testing – Vibration – By mechanical waves

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

73602, 73609, 73613, G01N 2912

Patent

active

053515447

ABSTRACT:
A measuring apparatus using an ultrasonic wave according to the invention transmits an ultrasonic wave pulse into a specimen, receives the echo reflected by the specimen and converts it into an electric signal. The components of the electric signal that represent the wave reflected by the specimen and contain data on the state of the specimen are extracted by a gate circuit. The components obtained by the gate circuit are converted into a power spectrum by a circuit for performing a Fourier transformation. The thickness of the specimen and/or the flaking state of the specimen can be determined from this power spectrum.

REFERENCES:
patent: 4428235 (1984-01-01), Sugiyama
patent: 4429576 (1984-02-01), Norris
patent: 4452082 (1984-06-01), Miwa
patent: 4655228 (1987-04-01), Shimura et al.
patent: 4694699 (1987-09-01), Cheeke
patent: 4893510 (1990-01-01), Ichikawa et al.
patent: 5029475 (1991-07-01), Kikuchi et al.
"Detection of Smooth Bondings of Polymer Coatings by Ultrasound Spectroscopy", by Y. Tsukahara and K. Ohira, Ultrasonics, 1989 vol. 27. Jan., pp. 3-7.
"Werkstoffprufung mit Ultraschall" by J. Krautkramer and H. Krautkramer, 5th Edition, 1986 pp. 356-359.
"High -Frequency Ultrasonic Testing of Bonds: Application to Silicon Power Devices" by R. S. Gilmore, M. L. Torreno, G. J. Czerw and L. B. Burnet (Materials Evaluation) Jan. 1979 pp. 65-72.
"Ultraschallprufung an dunner Bauteilen mit Frequenzen uber 20 MHz" by E. Neumann, E. Nabel, and K. Matthies (Materialpruf) (Aug. 1978) pp. 291-294.
"Ultrasonic System for imaging delaminations in composite materials", by P. A. Lloyd (Ultrasonics) vol. 27 Jan. 1989 pp. 8-18.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Measuring apparatus using an ultrasonic wave to provide flaking does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Measuring apparatus using an ultrasonic wave to provide flaking , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Measuring apparatus using an ultrasonic wave to provide flaking will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-573878

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.