Measurement system cluster

Details Measurement system cluster Measurement system cluster

2006-02-14

2006-02-14

Pham, Hoa Q. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237500, C700S121000

Reexamination Certificate

active

06999164

ABSTRACT:
Systems and methods are disclosed for measuring semiconductor wafers in a fabrication process using one or more of a plurality of measurement systems. A measurement system cluster is provided having a plurality of such measurement systems, along with a system for transferring wafers to one or more of the measurement systems according to one or more selection criteria. Measurement systems may be selected for use based on availability and throughput capabilities, whereby overall system throughput and efficiency may be improved within the required accuracy capabilities required for measuring process parameters associated with the wafers.

REFERENCES:
patent: 5393624 (1995-02-01), Ushijima
patent: 5442416 (1995-08-01), Tateyama et al.
patent: 5492594 (1996-02-01), Burke et al.
patent: 5616063 (1997-04-01), Okumura et al.
patent: 5695601 (1997-12-01), Kodera et al.
patent: 5909276 (1999-06-01), Kinney et al.
patent: 5948203 (1999-09-01), Wang
patent: 6028664 (2000-02-01), Cheng et al.
patent: 6157450 (2000-12-01), Marchese-Ragona et al.
patent: 6166801 (2000-12-01), Dishon et al.
patent: 6368181 (2002-04-01), Dvir et al.
patent: 6556947 (2003-04-01), Scheiner et al.
patent: 6701259 (2004-03-01), Dor et al.
patent: 2002/0090744 (2002-07-01), Brill et al.
patent: 2002/0165636 (2002-11-01), Hasan
G. Dishon et al., “Dielectric CMP Advanced Process Control Based on Integrated Thickness Monitoring,”CMP-MIC Conference 1998 IMIC, vol. 300P, Feb. 19-20, 1998, pp. 267-274.
G. Dishon et al., “On-Line Integrated Metrology for CMP Processing,”CMP-MIC Conference 1996 ISMIC, vol. 100P, Feb. 22-23, 1996, pp. 273-276.
G. Dishon et al. “Monitoring Choices of CMP Planarization Processes,” Reprinted from:VMICSpecialty Conference, 2nd International CMP Planarization Conference, Santa Clara, California , Feb. 13-14, 13 pages in length.
International Search Report dated Aug. 28, 2002 for PCT/US02/13158 filed Apr. 24, 2002.

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