Measurement of wafer temperature in semiconductor processing...

Details Measurement of wafer temperature in semiconductor processing... Measurement of wafer temperature in semiconductor processing...

2005-03-08

2005-03-08

Pert, Evan (Department: 2829)

Semiconductor device manufacturing: process

With measuring or testing

C374S183000

Reexamination Certificate

active

06864108

ABSTRACT:
A coil (50) is placed adjacent to a semiconductor wafer (10). An AC excitation current is used to create a changing electromagnetic field (60) is the wafer (10). The wafer is heated by a heat source (20) and the conductivity of the wafer (10) will change as a function of the wafer temperature. Induced eddy currents will cause the inductance of the coil (50) to change and the temperature of the wafer (10) can be determined by monitoring the inductance of the coil (50).

REFERENCES:
patent: 3707873 (1973-01-01), Young
patent: 4095469 (1978-06-01), Yamada et al.
patent: 4799046 (1989-01-01), Heinen
patent: 5354130 (1994-10-01), Seppa et al.
patent: 5477035 (1995-12-01), Matsumoto et al.

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