Measurement of trace element concentration distribution, and eva

Radiant energy – Ionic separation or analysis – Methods

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250309, G01N 23225

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active

054421748

ABSTRACT:
A concentration distribution in a planar direction or in a depth-wise direction is measured by irradiating an ion containing an alkali metal element as an ion beam onto a solid surface, detecting a three-atom composite ion comprising the irradiated alkali metal ion, an object element, and a base material element from among particles emitted from the solid surface due to sputtering by mass separation, and displaying an intensity distribution of the three-atom composite ion as a two-dimensional image in the case of the concentration distribution in the planar direction or displaying the intensity of the three-atom composite ion with the sputter time in the case of the concentration distribution in the depth-wise direction. A carrier concentration distribution is obtained by irradiating primary ions to the surface of a semiconductor, into which an electrically conductive impurity is introduced, under conditions such that electrically charge up occurs on the surface of the first semiconductor, sequentially measuring the intensity of secondary ions emitted from the surface and having a specific energy level, during the irradiation time, and calculating the concentration distribution from the carrier concentration corresponding to the intensity of the secondary ions and from an etching quantity of the first semiconductor corresponding to the irradiation time of the primary ions.

REFERENCES:
patent: 5148027 (1992-09-01), Umemura et al.
patent: 5208457 (1993-05-01), Tsuji
Klaus Wittmaack, "Surface and Depth Analysis Based on Sputtering", Sputtering by Particle Bombardment III, pp. 196-256 (1991).

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