Measurement of surface area for electrodeposition plating proces

Weighing scales – Processes

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177 25, 364567, 73432R, G01G 2322

Patent

active

045482853

ABSTRACT:
A method and apparatus for accurately calculating the plating area and current plating density for an etched circuit in connection with the electrodeposition of conducting material upon printed circuit boards used in electronic apparatus, including a system for making comparative weight determinations of a test board and calculating the circuit surface area bored thereon.

REFERENCES:
patent: 240678 (1881-04-01), Edison
patent: 3755659 (1973-08-01), Bolhuis
patent: 3871489 (1975-03-01), Patigalia
patent: 4135006 (1979-01-01), Readal et al.
patent: 4459783 (1984-07-01), Odell, II et al.

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