Optics: measuring and testing – By alignment in lateral direction – With registration indicia
Reexamination Certificate
2007-03-20
2007-03-20
Toatley, Jr., Gregory J. (Department: 2877)
Optics: measuring and testing
By alignment in lateral direction
With registration indicia
C257S797000, C430S022000, C430S030000, C438S401000
Reexamination Certificate
active
10714460
ABSTRACT:
A method for measuring overlay in semiconductor wafers includes obtaining diffraction based and imaging based measurements of the same target. The two separate measurements are then combined in a way that is consistent to both measurements to obtain an overlay measurement that has high precision and large range.
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Huang Hsu-Ting
Sezginer Abdurrahman
Smedt Rodney
Stallman & Pollock LLP
Stock, Jr. Gordon J.
Toatley , Jr. Gregory J.
Tokyo Electron Limited
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