Measurement of components that have been micro-galvanically...

Details Measurement of components that have been micro-galvanically... Measurement of components that have been micro-galvanically...

2005-02-15

2005-02-15

Williams, Hezron (Department: 2856)

Measuring and testing

Inspecting

Reexamination Certificate

active

06854347

ABSTRACT:
A method for measuring microgalvanically produced components having a three-dimensional, depth-lithographically produced structure, which provides a single- or multilayer component which is constructed using galvanic metal deposition, the metal being deposited around a structure of photoresist defining the desired orifice contour of the component; in the process, a photoresist region, which selectively interrupts the structure of the component to be manufactured, being incorporated during the microgalvanic production; at least the interrupting photoresist region being dissolved out of the interrupted component; and a contactless measuring of the orifice structure of the interrupted component being undertaken in the region of a previously existing resist edge of the photoresist region using a measuring device.

REFERENCES:
patent: 196 07 288 (1996-10-01), None
patent: 1161821 (1985-06-01), None

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