Measurement method, exposure method and device manufacturing...

Optics: measuring and testing – Lens or reflective image former testing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S030000

Reexamination Certificate

active

07948616

ABSTRACT:
An image of an aperture pattern that includes an L/S pattern having a linewidth that exceeds the measurement resolution of a measurement device is generated in each of divided areas on a wafer via an optical system. A part of each of the divided areas on the wafer exposed via a projection optical system, and an image of the aperture pattern after removal of a part of the image of the L/S pattern is formed in each of the divided areas. An image of the pattern that is obtained by removing a part of the pattern is formed in each of the divided areas after the wafer is developed. Measurement is performed by a measurement device using the wafer as a sample, and the optical characteristics of the projection optical system (such as a best focus position, field of curvature, or astigmatism) are obtained.

REFERENCES:
patent: 4759626 (1988-07-01), Kroko
patent: 4908656 (1990-03-01), Suwa et al.
patent: 5402224 (1995-03-01), Hirukawa et al.
patent: 5434026 (1995-07-01), Takatsu et al.
patent: 5448332 (1995-09-01), Sakakibara et al.
patent: 5615006 (1997-03-01), Hirukawa et al.
patent: 5646413 (1997-07-01), Nishi
patent: 5760879 (1998-06-01), Shinonaga et al.
patent: 6011611 (2000-01-01), Nomura et al.
patent: 6611316 (2003-08-01), Sewell
patent: 6706456 (2004-03-01), Miyashita et al.
patent: 6778257 (2004-08-01), Bleeker et al.
patent: 6952253 (2005-10-01), Lof et al.
patent: 2001/0053489 (2001-12-01), Dirksen et al.
patent: 2003/0025890 (2003-02-01), Nishinaga
patent: 2004/0179190 (2004-09-01), Miyashita et al.
patent: 2005/0259234 (2005-11-01), Hirukawa et al.
patent: 2005/0280791 (2005-12-01), Nagasaka et al.
patent: 2006/0231206 (2006-10-01), Nagasaka et al.
patent: 2007/0046929 (2007-03-01), Shiode
patent: 2008/0208499 (2008-08-01), Miyashita
patent: 1 420 298 (2004-05-01), None
patent: A-03-155112 (1991-07-01), None
patent: A-05-062882 (1993-03-01), None
patent: A-06-117831 (1994-04-01), None
patent: A-06-283403 (1994-10-01), None
patent: A-07-176468 (1995-07-01), None
patent: A-10-303114 (1998-11-01), None
patent: A-11-142108 (1999-05-01), None
patent: A-2001-313250 (2001-11-01), None
patent: A-2004-146702 (2004-05-01), None
patent: A-2004-165307 (2004-06-01), None
patent: A-2004-519850 (2004-07-01), None
patent: A-2004-289126 (2004-10-01), None
patent: WO 99/49504 (1999-09-01), None
patent: WO 01/35168 (2001-05-01), None
patent: WO 2004/055803 (2004-07-01), None
patent: WO 2004/057590 (2004-07-01), None
patent: WO 2004/086468 (2004-10-01), None
patent: WO 2005/029559 (2005-03-01), None
patent: WO 2007/043535 (2007-04-01), None
U.S. Appl. No. 12/078,864, filed Apr. 7, 2008 Miyashita.
International Search Report of PCT/JP2008/000953, dated Jul. 15, 2008.
Written Opinion of the International Searching Authority for PCT/JP2008/000953, dated Jul. 15, 2008, w/English-language translation.
International Search Report of PCT/JP2006/320232, dated Dec. 5, 2006.
Written Opinion of the International Searching Authority for PCT/JP2006/320232, dated Dec. 5, 2006, w/English-language translation.
Supplementary European Search Report for EP 06 81 1544, dated Feb. 16, 2010.
English-language translation of JP-A-2004-146702.
Office Action issued in U.S. Appl. No. 12/078,864, issued Sep. 1, 2010.
Supplementary European Search Report for EP 06 81 1544, dated Feb. 16, 2010.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Measurement method, exposure method and device manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Measurement method, exposure method and device manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Measurement method, exposure method and device manufacturing... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2692538

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.