Measurement method, adjustment method and adjustment system for

Details Measurement method, adjustment method and adjustment system for Measurement method, adjustment method and adjustment system for

1991-02-01

1992-04-21

Dixon, Jr., William R.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 123, 106 126, C23C 1816, C23C 1844

Patent

active

051064138

ABSTRACT:
Disclosed herein are a method for measuring the concentration of one or more ingredients in an electroless plating solution containing at least one metal ingredient, anions and a reducing agent, and concentration adjustment method and system making use of the method. The method features measurement of the concentration of the reducing agent after replacing the anions with anions of a different type which does not affect the measurement of the concentration of the reducing agent. The measurement of the concentration of the metal ingredient can be conducted by atomic absorption spectrometry or plasma spectro.metry, while that of the reducing agent can be performed by ultraviolet absorption spectroscopy or electrochemical quantitative analysis. Preferably, the measurement of the concentrations of one or more ingredients in the electroless plating solution, calibration of concentration measuring instruments and the replacement of the anions with the anions of the different type are performed under sequence control according to a preset sequence program, and the concentrations of the metal ingredient and the reducing agent are determined by computation.

REFERENCES:
patent: 3770464 (1973-11-01), Dutkewych et al.
patent: 4229218 (1980-10-01), Gulla et al.
patent: 4276323 (1981-06-01), Oka et al.
patent: 4324589 (1982-04-01), Gulla et al.
patent: 4565575 (1986-01-01), Cardin et al.

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