Measurement and control of strained devices

Semiconductor device manufacturing: process – Including control responsive to sensed condition

Reexamination Certificate

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Details

C438S197000, C438S669000, C438S264000, C438S257000, C257S088000, C257S288000, C257SE21409, C257SE33062

Reexamination Certificate

active

07838309

ABSTRACT:
A method that includes measuring stress on at least one of a monitor substrate, a production substrate, and a proxy device on a production substrate to produce stress data, measuring shape on at least one of a proxy device on a production substrate and a production device on a production substrate to produce shape data, and inputting the stress data and the shape data into an elastic deformation calculation to determine a stress value for a production device.

REFERENCES:
patent: 5134622 (1992-07-01), Deacon
patent: 6309926 (2001-10-01), Bell et al.
patent: 6483580 (2002-11-01), Xu et al.
patent: 6924497 (2005-08-01), Suresh et al.
patent: 2009/0033931 (2009-02-01), Murtagh et al.
patent: 2009/0315044 (2009-12-01), Amundson et al.

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