Semiconductor device manufacturing: process – Including control responsive to sensed condition
Reexamination Certificate
2008-08-27
2010-11-23
Brewster, William M (Department: 2823)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
C438S197000, C438S669000, C438S264000, C438S257000, C257S088000, C257S288000, C257SE21409, C257SE33062
Reexamination Certificate
active
07838309
ABSTRACT:
A method that includes measuring stress on at least one of a monitor substrate, a production substrate, and a proxy device on a production substrate to produce stress data, measuring shape on at least one of a proxy device on a production substrate and a production device on a production substrate to produce shape data, and inputting the stress data and the shape data into an elastic deformation calculation to determine a stress value for a production device.
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patent: 2009/0315044 (2009-12-01), Amundson et al.
Fielden John
Levy Ady
Wack Daniel C.
Baptiste Wilner Jean
Brewster William M
KLA-Tencor Corporation
Luedeka Neely & Graham P.C.
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