Measurement alignment system to determine alignment between...

Details Measurement alignment system to determine alignment between... Measurement alignment system to determine alignment between...

2006-09-11

2008-11-25

Nguyen, Vincent Q (Department: 2831)

Electricity: measuring and testing

Impedance, admittance or other quantities representative of...

Lumped type parameters

C324S679000

Reexamination Certificate

active

07456637

ABSTRACT:
An embodiment of the present invention relates to a alignment measurement system for measuring alignment between a plurality of chips of a device, the chips being assembled in a three-dimensional stacking configuration and equipped with at least an integrated capacitive sensor, including a multiple-capacitor structure integrated in the capacitive sensor, at least a sensing circuit connected to the multiple-capacitor structure which issues an output voltage, proportional to a variation of a capacitive value of the multiple-capacitor structure of the integrated capacitive sensor of the device and corresponding to a measured misalignment between the chips of the device.

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European Search Report for EP 05 01 9639 dated Nov. 16, 2005.

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