Means to improve center to edge uniformity of...

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Reexamination Certificate

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C204S242000

Reexamination Certificate

active

07141146

ABSTRACT:
An electrochemical mechanical process for electroplating or electropolishing a conductive surface of a wafer is provided. The conductive surface of the wafer is touched by a polishing surface of a compressible pad while a process solution flows through the pad and a potential difference is maintained between the conductive surface and an electrode. The pressure between the polishing surface and a central region of the conductive surface is increased by applying a shaping process to either the conductive surface or the pad.

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Chinese Office Action dated Jun. 25, 2004, with English Translation.
Mikkola et al.,“Investigation of the roles of the additive components for second generation copper electroplating chemistries used for advanced Interconnect metallization,”2000 IEEE, Jun. 2000, pp. 117-119, IEEE Electron Devices Society.
Steigerwald, et al., “Chemical mechanical planarization of microelectronic materials,” 1997, pp. 212-222, A. Wiley-Interscience Publication, by John Wiley & Sons, month not available.

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