Special receptacle or package – Holder for a removable electrical component – Bar or tapelike carrier for plural components
Reexamination Certificate
1998-06-30
2002-03-19
Luong, Shian (Department: 3728)
Special receptacle or package
Holder for a removable electrical component
Bar or tapelike carrier for plural components
C206S460000
Reexamination Certificate
active
06357594
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to the field of automated packaging systems. More particularly, the present invention relates to the field adhesive backed carrier tape packaging systems utilizing pressure sensitive adhesive (PSA) tapes.
2. Description of the Prior Art
The following thirteen (13) prior art patents are found to be pertinent to the field of the present invention:
1. U.S. Pat. No. 2,885,849 issued to Wohlman, J R on May 12, 1959 for “Semiconductor Taping Apparatus” (hereafter the “Wohlman Patent”);
2. U.S. Pat. No. 3,177,629 issued to Anspach on Apr. 13, 1965 for “Apparatus for Loading Components” (hereafter the “Anspach Patent”);
3. U.S. Pat. No. 3,608,711 issued to Wiesler et al. on Sep. 28, 1971 for “Package for Electronic Devices and the Like”. (hereafter the “'711 Wiesler Patent”);
4. U.S. Pat. No. 3,691,436 issued to Maijers et al. on Sep. 12, 1972 for “Electrical Circuit Element having a Diagonal Abutment Strip and Method of Manufacturing the Same” (hereafter the “Maijers Patent”);
5. U.S. Pat. No. 3,785,507 issued to Wiesler et al. on Jan. 15, 1974 for “Die Sorting System” (hereafter the “'507 Wiesler Patent”);
6. U.S. Pat. No. 3,881,245 issued to Dudley et al. on May 6, 1975 for “Mounting Electrical Components On Thick Film Printed Circuit Elements” (hereafter the “Dudley Patent”);
7. U.S. Pat. No. 3,971,193 issued to Tardiff et al. on Jul. 27, 1976 for “Machines For Sequencing Diverse Components” (hereafter the “Tardiff Patent”);
8. U.S. Pat. No. 4,298,120 issued to Kaneko et al. on Nov. 3, 1981 for “Chip-Like Electronic Component Series And Method For Supplying Chip-Like Electronic Components” (hereafter the “Kaneko Patent”);
9. U.S. Pat. No. 4,340,774 issued to Nilsson et al. on Jul. 20, 1982 for “Device For Mounting Circuit Components On A Circuit Board” (hereafter the “Nilsson Patent”);
10. U.S. Pat. No. 4,575,995 issued to Tabuchi et al. on Mar. 18, 1986 for “Automatic Producing Apparatus Of Chip-Form Electronic Parts Aggregate” (hereafter the “Tabuchi Patent”);
11. U.S. Pat. No. 4,724,954 issued to Sillner on Feb. 16, 1988 for “System For Conveying And Guiding Components, In Particular Electrical Construction Elements Which Are Held On A Belt In A Radially Or Quasi-Radially Belted Manner” (hereafter the “Sillner Patent”);
12. U.S. Pat. No. 4,954,207 issued to Higuchi et al. on Sep. 4, 1990 for “Apparatus For Automatically Taping Electronic Components” (hereafter the “Higuchi Patent”); and
13. U.S. Pat. No. 5,203,143 issued to Gutentag on Apr. 20, 1993 for “Multiple And Split Pressure Sensitive Adhesive Stratums For Carrier Tape Packaging System” (hereafter the “'143 Patent”).
The Wohlman Patent discloses a semiconductor taping apparatus. The semiconductors are taped at lateral ends by a pair of first tapes, and another pair of second tapes where the adhesives in the first tapes face the adhesive side of the tapes in the pair of second tapes.
The Anspach Patent discloses an apparatus for loading components. These components are primarily larger components and also are primarily leaded diodes. A gap is provided in the carrier where the heads of the transistors are placed, but the transistors themselves are carried by having the lead sandwiched between the carrier tape and an adhesive tape.
The '711 Wiesler Patent discloses a package for electronic devices and the like, which utilizes a tape with a plurality of openings to receive a device. The device is held in place by an adhesive tape applied from the back, which is exposed at the opening and serves as a tape stratum for holding the device in place.
The Maijers Patent discloses an electrical circuit element having a diagonal abutment strip and method of manufacturing the same. In the Maijers Patent, small discrete components are interconnected by means of a strip of tape.
The '507 Wiesler Patent discloses a die sorting system which uses a strip comprised of a relatively narrow strip formed with indexing holes along one edge, and storage holes near the outer edge of the strip. On the bottom side, a thin pressure sensitive adhesive tape is laminated to the strip and provides an adhesive floor to hold the die at the bottom of the storage holes.
The Dudley Patent discloses a device for mounting electrical components on thick film printed circuit elements. Two metal strips are attached to printed areas and adhered by electrical resistance welding for contacting electrodes.
The Tardiff Patent discloses machines for sequencing diverse components. In the Tardiff Patent, small electrical components are sequenced and interconnected with tape at opposite ends of their lead portions.
The Kaneko Patent discloses a chip-like electronic component series and method for supplying chip-like electronic components. It comprises a tape-like member formed with a plurality of apertures with upper and lower cover sheets that contain small chip-like electronic components.
The Nilsson Patent discloses a device for mounting circuit components on a circuit board which includes apertures in the plate designed to hold by means of a friction fit.
The Tabuchi Patent discloses an automatic producing apparatus of chip-form electronic parts aggregate. It comprises a tape-like housing body which has a feed hole along the side and a frame type housing hole with a specific pitch between the housing holes.
The Sillner Patent discloses a system for conveying and guiding components, in particular electrical construction elements which are held on a belt in a radially or quasi-radially belted manner. The components are also held by tape at the ends of their leads.
The Higuchi Patent discloses an apparatus for automatically taping electronic components. The electronic components are placed on an elongated tape body at a regular pitch and an adhesive tape is applied to fix the electronic components in position. The electronic component is placed on an elongated first tape and by applying a second tape, the component is fixed between the two tapes.
The Sillner Patent discloses a system for conveying and guiding components, in particular electrical construction elements which are held on a belt in a radially or quasi-radially belted manner. The components in the Sillner Patent are also held by tape at the ends of their leads.
Historically, a solid band of pressure sensitive adhesive (PSA) tape is affixed to a punched plastic carrier tape frame. Integrated circuit (IC) chips on this solid band of PSA tape are sequentially and repeatably placed with the entire back side of each IC chip affixed to and covered by the PSA tape. Such means of adhesive attachment is equivalent to that which is used when the complete wafer from which the IC chips were obtained was prepared and processed for use on an adhesive matrix film mounted in a saw ring or frame. The shear forces encountered during sawing of the silicon wafer to singulate IC chips require 100% adhesion of the wafer to the PSA film to maintain accuracy and integrity of the saw cuts. Once sawn from the wafer and transferred to the adhesive backed carrier tape for storage and transport, individual IC chips are no longer subjected to high level of shear forces. Accordingly, 100% backside surface attachment of each wafer die to a solid band of PSA tape is not required to maintain secure attachment and retention of pre-positioned IC chip orientation. Furthermore, such 100% backside adhesion to the PSA tape is excessive and causes major problems when removing IC chips from the adhesive backed carrier tape. These problems include mis-picks during automated high speed assembly placement of IC chips, physical and functional damage to the IC chips, and disorientation of the IC chip as originally placed on the adhesive backing, requiring elaborate positional correction of each IC chip prior to placement with requisite accuracy. The need for properly orienting each IC chip prior to placement is presently obtained by pick and place machines controlled by sophisticated and costly vision systems. Yet a greater cost penalty i
Chen Tony D.
Fong Jerry
Luong Shian
Rozsa Thomas I.
Tempo G
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