Means of seeding and metallizing polyimide

Details Means of seeding and metallizing polyimide Means of seeding and metallizing polyimide

2006-04-25

2006-04-25

Padgett, Marianne (Department: 1762)

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

C427S539000, C427S555000, C427S098300, C427S125000, C427S306000, C216S065000

Reexamination Certificate

active

07033648

ABSTRACT:
A method to selectively metallize polyimide with an all-electroless process.

REFERENCES:
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patent: 4780177 (1988-10-01), Wojnarowski et al.
patent: 4865873 (1989-09-01), Cole, Jr. et al.
patent: 5132108 (1992-07-01), Narayanan et al.
patent: 5169678 (1992-12-01), Cole et al.
patent: 5275882 (1994-01-01), Conley
patent: 5314709 (1994-05-01), Doany et al.
patent: 5576073 (1996-11-01), Kickelhain

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