Means for reducing signal propagation losses in very large scale

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357 71, 357 59, 357 53, 357 54, 357 84, H01L 2348, H01L 2946, H01L 2904, H01L 2940

Patent

active

048335215

ABSTRACT:
A method and means for reducing signal propagation losses in very large scale integrated circuits is provided comprising a ground plane located adjacent to, but insulated from, a conductive signal layer overlying an active region in a semiconductor substrate. While, the ground plane is preferrably disposed between the signal layer and the substrate, it may be disposed above the signal layer. Moreover, two or more signal layers may be employed and sandwiched between a pair of ground planes.

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patent: 4197554 (1980-04-01), Meusburger et al.
patent: 4475118 (1984-10-01), Klein et al.

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