Means for increasing the critical heat flux of an immersed surfa

Details Means for increasing the critical heat flux of an immersed surfa Means for increasing the critical heat flux of an immersed surfa

1981-08-05

1984-10-02

Richter, Sheldon J.

Heat exchange

With coated, roughened or polished surface

62 64, 62373, 165DIG11, F28F 1318

Patent

active

044742312

ABSTRACT:
Structured boiling surfaces for increasing the critical heat flux of immersed surfaces are disclosed. The structures comprise holes or cavities in the boiling surface which constrain vapor jets to be less than the natural spacing thereof, which satisfy the vapor-liquid flooding criteria and which supply added surface area. A configuration having an arcuate surface in order to facilitate vapor removal therefrom when operated in a downwardly facing direction is disclosed.

REFERENCES:
patent: 3207209 (1965-09-01), Hummel
patent: 3301314 (1967-01-01), Gaertner
patent: 3684007 (1972-08-01), Ragi
patent: 4050507 (1977-09-01), Moran
patent: 4223723 (1980-09-01), Hilal
patent: 4380907 (1983-04-01), Barnes
patent: 4434842 (1984-03-01), Gregory
J. H. Lienhard, V. K. Dhir, D. M. Riherd, "Peak Pool Boiling Heat-Flux Measurements on Finite Horizontal Flat Plates", Jrnl. of Heat Transfer, Nov. 1973, pp. 477-482.
J. C. Corman, M. H. McLaughlin, "Boiling Augmentation with Structured Surfaces", ASHRAE Trans. 82(1), 1976, pp. 906-918.
J. H. Lienhard, V. K. Dhir, "Hydrodynamic Prediction of Peak Pool-Boiling Heat Fluxes from Finite Bodies", Trans. of ASME, May, 1973, pp. 152-158.

Affiliated with

Also associated with

Rating

Means for increasing the critical heat flux of an immersed surfa does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Means for increasing the critical heat flux of an immersed surfa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Means for increasing the critical heat flux of an immersed surfa will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-522834