Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2006-09-05
2006-09-05
Schillinger, Laura M. (Department: 2813)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S311000, C438S149000
Reexamination Certificate
active
07101772
ABSTRACT:
A method for forming a SOI structure in which porous silicon is sealed and an epitaxial layer is grown thereover, followed by implantation of oxygen and annealing.
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Houston Theodore W.
Joyner Keith A.
Brady III Wade James
Schillinger Laura M.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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