Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1994-02-24
1996-01-09
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257719, 257726, H01L 2334
Patent
active
054831032
ABSTRACT:
Apparatus is presented herein for resiliently clamping at least one semi-conductor device to a support having an upper surface and wherein the semi-conductor device includes a housing having upper and lower spaced-apart relatively flat surfaces interconnected by an upstanding cylindrical wall. A leveller is provided having an upper dome-shaped contact surface and a lower surface having a circular-shaped first recess formed therein. The first recess is shaped and is of sufficient size to receive the upper portion of the housing including the upper surface thereof and a portion of the height of the cylindrical wall while the lower surface of the housing is located on the upper surface of the support. An elongated spring overlies and is resiliently biased toward and engages the dome-shaped contact surface of the leveller. A fastener secures the spring to the support such that the spring exerts a resilient force against the dome-shaped contact surface of the leveller to resiliently clamp the semi-conductor device against the upper surface of the support.
REFERENCES:
patent: 4591896 (1986-05-01), Kikuchi
patent: 4853762 (1989-08-01), Ewer et al.
patent: 4908695 (1990-03-01), Morihara et al.
patent: 5251098 (1993-10-01), Schmidt
Blickhan Joseph D.
Bonds David K.
Crockett Robert J.
Mazurek James E.
Milfs Dennis J.
Harris Corporation
Mintel William
Potter Roy
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