Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-06-01
2000-04-04
Stephan, Steven L.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
361749, H01R 909
Patent
active
060453680
ABSTRACT:
An electrical circuit includes a substrate having at least two alignment pads on the substrate that are accurately aligned with a first set of electrical interconnect pads, and also includes a corresponding number of alignment posts that are cylindrical and have flat bases that are geometrically similar to and smaller than a corresponding shape of each of the at least two alignment pads by a predetermined solder fillet radius. Each of the at least two alignment posts is reflow soldered to one of the at least two alignment pads. An electrical part can be accurately aligned to the substrate using the alignment posts, during attachment of the electrical part.
REFERENCES:
patent: 4678250 (1987-07-01), Romine et al.
patent: 5641291 (1997-06-01), Sueki et al.
patent: 5726861 (1998-03-01), Ostrem
Cadenhead Jonathan
Fleegle Terry Richard
Menard Michael Carlos
Abdulmelik Amir
Lamb James A.
Stephan Steven L.
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