Means and method for testing integrated circuits attached to a l

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

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324158P, 29827, G01R 106, G01R 3102

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050086154

ABSTRACT:
Apparatus and method of testing integrated circuits after the leads have been trimmed and partially formed, but before the package has been removed from the leadframe. One stage of a progressive trim and form process is adapted to test the integrated circuits by providing a membrane test head positioned underneath the IC package, wherein the membrane test head is coupled to an external tester. After the leads are electrically separated from each other end from the leadframe, the leads are aligned to the membrane test head and an inflatable bladder, which is positioned underneath the membrane test head, is inflated to couple the membrane test head to the leads. In this manner, one or more integrated circuits can be tested while still attached to the leadframe.

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Barsotti et al., "Very High Density Probing", IEEE 1988, International Test Conference; pp. 608-614; 10-4-1988.
Leslie et al., "Membrane Probe Card Technology", IEEE 1988 International Test Conference; pp. 601-607, 12/1988.
Brochure: "Automatic Test Equipment for IC and VLSI Devices"; ANDO Electric, 12/1988.

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