Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-10-20
2000-08-22
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361705, 361706, 361707, 361709, 251706, 251707, 251712, 251713, 174 51, H05K 720
Patent
active
061082058
ABSTRACT:
The present invention relates to a method and device for making a temperature-compensated bedding for chips on printed boards, at which a temperature-compensated device is totally or partly recessed in a carrier in the printed board. The chips is placed over the temperature-compensated device.
The temperature-compensated device includes a piece of metal recessed in the carrier under the chip. A layer of copper is fixed against the upper side of the carrier and the upper side of the metal piece. The thickness of the copper layer and the thickness of the metal piece are dimensioned so that the resulting coefficient of linear expansion at the upper side of the copper layer is equally big as or a bit bigger than the coefficient of linear expansion of the chip.
The temperature-compensated device can as an alternative to the above include a module recessed in the carrier under the chip. A thin layer of dielectric is fixed against the carrier, so that the coefficient of linear expansion of the dielectric layer don't appreciable affect the resulting coefficient of linear expansion of the temperature-compensated device.
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International-Type Search Report--corresponding to Application No. SE 9603863-3, mailed Jul. 4, 1997.
Chervinsky Boris L.
Picard Leo P.
Telefonaktiebolaget LM Ericsson
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