MCM (Multi Chip Module) carrier with external connection teminal

Details MCM (Multi Chip Module) carrier with external connection teminal MCM (Multi Chip Module) carrier with external connection teminal

1995-11-27

1998-07-21

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361761, 361764, 361777, 361760, H05K 111, H05K 114

Patent

active

057842647

ABSTRACT:
The MCM carrier having wiring layers on front and back surfaces and internally thereof. The MCM carrier includes first and second IC chips, an MCM board, and a carrier board. The first IC chip is mounted on the front surface of the MCM board and connected to the wiring layers, and the second IC chip is mounted on the back surface of the MCM board and connected to the wiring layers. The MCM board has a plurality of carrier board connection pads at a peripheral portion on the back surface thereof and the carrier board has MCM board connection terminals and external connection terminals in a matrix form. The MCM board and the carrier board are connected with each other through the carrier board connection pads and the MCM board connection terminals. This MCM carrier can be fabricated at high production yield and low cost with the overall structure being significantly scaled down.

REFERENCES:
patent: 4882657 (1989-11-01), Braun
patent: 5438224 (1995-08-01), Papageorge et al.
Electronic Parts and Materials, vol. 33, No. 5, published by Kogyo-Chosakai Publishing Co. Ltd., May 1994, pp. 37-42.

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