Mattress assembly with semiconductor thermo-control

Beds – With heating or cooling

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Details

5284, 165 46, A47C 2104

Patent

active

055555799

ABSTRACT:
A mattress assembly includes a mattress having a network of grooves at the top covered within a soft covering layer, a control box, a water piping arranged within the network of grooves and connected to hot and cold water reservoirs inside the control box, the control box having a semiconductor chip controlled by a control circuit to heat the hot water reservoir and to cool the cold water reservoir, and hot and cold water pumps respectively controlled by the control circuit to send water from the hot or cold water reservoir to the water piping in regulating the temperature of the mattress.

REFERENCES:
patent: 2093834 (1937-09-01), Gaugler
patent: 2250325 (1941-07-01), Barnes
patent: 2504308 (1950-04-01), Donkle
patent: 4777802 (1988-10-01), Feher
patent: 4884304 (1989-12-01), Elkins
patent: 5038852 (1991-08-01), Johnson

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