Materials with thermally reversible curing mechanism

Details Materials with thermally reversible curing mechanism Materials with thermally reversible curing mechanism

2011-07-12

2011-07-12

Sastri, Satya B (Department: 1762)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C430S311000, C430S330000, C427S099400

Reexamination Certificate

active

07976894

ABSTRACT:
Novel materials with thermally reversible curing mechanisms are provided. These inventive compositions are useful in forming microelectronic structures, such as dual damascene structures. The compositions comprise a crosslinkable polymer dispersed or dissolved in a solvent system with a crosslinking agent. In use, the compositions are applied to a substrate and crosslinked. Additional layers may be applied on top of the cured layer followed by additional processing steps. Upon exposure to a temperature above the crosslinking temperature of the composition, the cured layer will undergo a decrosslinking reaction to render the layer soluble in common photoresist solvents, including solvents used to make the composition itself. Thus, after processing, the remaining material can be dissolved away without damaging the substrate. The inventive materials are especially suited for processes involving low-k dielectric substrates.

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Vinyl Ethers, http://www.sigmaaldrich.com/materials-science/material-science-products.html?TablePage=16371064; Jun. 2, 2009, 4 pages.

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