Materials suitable for thermosetting

Details Materials suitable for thermosetting Materials suitable for thermosetting

1982-09-13

1983-09-20

Foelak, Morton

Plastic and nonmetallic article shaping or treating: processes

Forming articles by uniting randomly associated particles

Autogenously or by activation of dry coated particles

264109, 264126, 264DIG6, 428325, 521 54, 523218, 523219, B32B 516, B27V 500

Patent

active

044055439

ABSTRACT:
A material suitable for thermosetting includes a collection of hollow particles adhesively mixed with a thermosetting resin in such proportions that the mixture exists in a granular form and may be converted by thermosetting into a fused solid mass having a density not greater than 0.5 grams per cubic centimeter.
The particles may be glass microbubbles or phenolic microballoons and the resin may be a hardenable Friedel-Crafts resin. The material according to the invention is more suitable for packing into shaped cavities than known resins including those containing filler particles.

REFERENCES:
patent: 2806509 (1957-09-01), Bozzacco et al.
patent: 2978340 (1961-04-01), Veatch et al.
patent: 3030184 (1966-01-01), Alford
patent: 3030215 (1962-04-01), Veatch et al.
patent: 3166615 (1965-01-01), Farrell
patent: 3296153 (1967-01-01), Snogren
patent: 3325341 (1967-06-01), Shannon
patent: 3642675 (1972-02-01), McKenzie
patent: 3786004 (1974-01-01), Furuya et al.
patent: 4005033 (1977-01-01), Georgeau et al.
patent: 4040165 (1977-08-01), Miessler et al.
patent: 4115500 (1978-09-01), Voegeli
patent: 4352856 (1982-10-01), Smillie

Affiliated with

Also associated with

Rating

Materials suitable for thermosetting does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Materials suitable for thermosetting, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Materials suitable for thermosetting will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-587235