Metal fusion bonding – Solder form
Patent
1985-11-12
1987-04-07
Ramsey, Kenneth J.
Metal fusion bonding
Solder form
428511, 428913, B23K 3514
Patent
active
046553827
ABSTRACT:
This invention provides a device for placing elongate joint-forming preforms such as solder columns on electronic components such as chip carriers using a water soluble retaining member which positions and holds the preforms while they are attached to the electronic component. The retaining member is then dissolved in hot or cold water. The retaining member is constructed of water soluble or water dispersible paper in combination with coatings of or layers of a water soluble material such as polyethyleneoxide. The water soluble retaining member can be a laminate of alternating layers of water soluble paper and water soluble polymeric material.
REFERENCES:
patent: Re25200 (1962-07-01), Robinson et al.
patent: 3034922 (1962-05-01), Boc
patent: 3431166 (1969-03-01), Mizutani et al.
patent: 3472365 (1969-10-01), Tiedema
patent: 3680037 (1972-07-01), Nellis et al.
patent: 3736400 (1973-05-01), Spiegel et al.
patent: 3859125 (1975-01-01), Miller et al.
patent: 4379729 (1983-04-01), Cross
"Conductive Elastomeric Connector" data sheet CEC-011 by Technical Wire Product, Inc. a company residing in Cranford, N.J.; 7-1974.
Dissolve Product Brochure Bulletin No. 772 from Gilbreth Co., Cornwells Heights, PA.
Lopez, Jr. Arthur W.
Wong Geoffrey B.
Dillahunty T. Gene
Ramsey Kenneth J.
Raychem Corp.
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