Materials for semiconductor device assemblies

Details Materials for semiconductor device assemblies Materials for semiconductor device assemblies

1995-12-22

1999-01-05

Kopec, Mark

Compositions

Electrically conductive or emissive compositions

Free metal containing

252512, 524442, H01B 122, C08K 334, C08K 336

Patent

active

058558217

ABSTRACT:
A composition suitable for use as an underfill for an interconnection between a semiconductor device and a substrate, as a semiconductor device encapsulant, a dam, an adhesive for direct chip attachment, and as an electrical connection for semiconductor device and a substrate. The composition contains about 40 to 90 wt. % of an electrically conductive or non-conductive filler and a cyanate ester and epoxy resin component. The cyanate ester/epoxy resin component comprises about 10 to 70 wt. % cyanate ester material, about 30 to 90 wt. % of epoxy resin, about 0.1 to 1.5 wt. % metal chelate/amine solid curing catalyst and about 0.1 to 5 wt. % of a coupling agent.

REFERENCES:
patent: 3562214 (1971-02-01), Kubens et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4999699 (1991-03-01), Christie et al.
patent: 5074947 (1991-12-01), Estes et al.
patent: 5089440 (1992-02-01), Christie et al.
patent: 5121190 (1992-06-01), Hsiao et al.
patent: 5132778 (1992-07-01), Juskey et al.
patent: 5330684 (1994-07-01), Emori et al.
patent: 5646241 (1997-07-01), Dershem et al.

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