Materials for forming capacitor layer and printed wiring...

Details Materials for forming capacitor layer and printed wiring... Materials for forming capacitor layer and printed wiring...

2005-09-09

2008-09-30

Thomas, Eric (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S303000, C361S763000

Reexamination Certificate

active

07430106

ABSTRACT:
The object is to provide a material for forming a capacitor layer which is excellent in adhesion within a dielectric layer and a bottom electrode of a capacitor circuit. And to provide a material for forming a capacitor layer which has a new conductive layer for forming a bottom electrode capable of being used as an electrode serving also as a resistance circuit and the like. To solve the problem, the invention provides a conductive layer in which a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer or a nickel-phosphorus alloy layer, a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer, to assure excellent adhesion within the bottom electrode of a capacitor circuit and the dielectric layer in a printed wiring board having a dielectric layer between an top electrode and a bottom electrode.

REFERENCES:
patent: 6477302 (2002-11-01), Tatoh
patent: 6541137 (2003-04-01), Kingon et al.
patent: 6623865 (2003-09-01), Zou et al.
patent: 6649930 (2003-11-01), Farrell
patent: 7199470 (2007-04-01), Bogner et al.
patent: 10-098245 (1998-04-01), None
patent: 2000-064084 (2000-02-01), None
patent: 2001-355094 (2001-12-01), None
patent: 2004-080060 (2004-03-01), None

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