Materials and structure for a high reliability BGA...

Details Materials and structure for a high reliability BGA... Materials and structure for a high reliability BGA...

2007-10-30

2007-10-30

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S852000, C174S255000, C174S264000, C361S767000

Reexamination Certificate

active

10837015

ABSTRACT:
A ceramic circuit structure comprising a plurality of ceramic layers and at least one electronic component embedded within the plurality of ceramic layers. Within a first one of the ceramic layers is a via that passes through the ceramic layer. A contact pad is formed on a surface of the ceramic layer. A barrier cap is formed between the via and the contact pad. A dielectric ring covers a peripheral portion of the contact pad and an adjacent portion of the dielectric material layer surface immediately surrounding the contact pad, such that any solder that is applied to the contact does not contact the peripheral portion of the contact pad or the ceramic material.

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