Material separation to form segmented product

Details Material separation to form segmented product Material separation to form segmented product

2005-10-25

2005-10-25

Fiorilla, Chris (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S257000, C156S289000

Reexamination Certificate

active

06958106

ABSTRACT:
A method of removing selected portions of material from a base material using a plurality of different depth cuts (e.g., using laser cutting) such that apertured sections (or segments) are expeditiously removed for eventual use with another component or otherwise. In one example, the segmented section so removed can be used to bond various elements of an electronic package which in turn can then be positioned and used within an information handling system such as a computer, server, mainframe, etc.

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“DuPont™ Pyralux® HT Insulator Flexible Composites”, DuPont Electronic Materials.
Product Handbook for DuPont™ Tyvek®, pp. 1-25.

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