Material-saving resist spinner and process

Details Material-saving resist spinner and process Material-saving resist spinner and process

1993-03-22

1995-09-12

Bell, Janyce

Coating apparatus

With vacuum or fluid pressure chamber

118 52, 118 61, 118 64, 118313, 118315, 118320, 134105, 134902, C23C 1400, B08B 300, B65C 1300

Patent

active

054494052

ABSTRACT:
Spin coating of resist on a semiconductor wafer is done in a controlled chamber, starting with introducing a resist solvent vapor into the chamber from a nozzle or an adjacent chamber, applying the resist by spraying a very thin layer of the resist material and then removing solvent from the chamber. The result is a saving in resist material and enhanced coating uniformity.

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patent: 4732785 (1988-03-01), Brewer
patent: 4790262 (1988-12-01), Nakayama et al.
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patent: 5002008 (1991-03-01), Ushijima et al.
patent: 5095848 (1992-03-01), Ikeno
patent: 5234499 (1993-08-01), Sasaki et al.
K. Skidmore, "To Obtain Photoresist Films with the Characteristics Necessary for Fabricating VLSI/ULSI ICs, An Understanding and Control of Many Parameters is Required" Semiconductor International, pp. 57-62 (Feb. 1988).

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