Material for packaging electronic components

Details Material for packaging electronic components Material for packaging electronic components

2006-05-30

2006-05-30

Chen, Vivian (Department: 1773)

Stock material or miscellaneous articles

Composite

Of polyester

C428S457000, C428S458000, C428S461000, C428S463000, C428S483000, C428S515000, C428S520000, C428S522000, C428S523000, C428S688000, C428S689000, C428S702000, C428S918000

Reexamination Certificate

active

07052772

ABSTRACT:
The present invention provides a material for packaging electronic components. In one embodiment, the packaging material comprises (a) a puncture resistant film having opposed first and second major surfaces; (b) a substantially continuous metal free light transmissible layer disposed on the first surface of the puncture resistant film, wherein the light transmissible layer comprises at least one pair of polymer layer and transparent conductive oxide layer; and (c) a heat sealable layer disposed on the light transmissible layer or on the second surface of the puncture resistant film. Other embodiments are provided.

REFERENCES:
patent: 4387133 (1983-06-01), Ichikawa et al.
patent: 4699830 (1987-10-01), White
patent: 4842893 (1989-06-01), Yializis et al.
patent: 4954371 (1990-09-01), Yializis
patent: 5032461 (1991-07-01), Shaw et al.
patent: 5084356 (1992-01-01), Deak et al.
patent: 5440446 (1995-08-01), Shaw et al.
patent: 5719705 (1998-02-01), Machol
patent: 5725909 (1998-03-01), Shaw et al.
patent: 5756171 (1998-05-01), Moteki et al.
patent: 5792550 (1998-08-01), Phillips et al.
patent: 5853862 (1998-12-01), Murai et al.
patent: 5895723 (1999-04-01), Utz
patent: 5939205 (1999-08-01), Yokoyama et al.
patent: 6045864 (2000-04-01), Lyons et al.
patent: 6224948 (2001-05-01), Affinito
patent: 6231939 (2001-05-01), Shaw et al.
patent: 6351068 (2002-02-01), Yamazaki
patent: 6395209 (2002-05-01), Yoshida et al.
patent: 6432516 (2002-08-01), Terasaki et al.
patent: 6576294 (2003-06-01), Phillips et al.
patent: 6749940 (2004-06-01), Terasaki et al.
patent: 6921788 (2005-07-01), Izawa et al.
patent: 2001/0038894 (2001-11-01), Komada
patent: 2002/0022156 (2002-02-01), Bright
patent: 2003/0044552 (2003-03-01), Komada
patent: 2003/0068459 (2003-04-01), Yializis
patent: 2003/0068534 (2003-04-01), Ohkawa et al.
patent: 2004/0194967 (2004-10-01), Jaensch
patent: 2000238177 (2000-09-01), None
patent: 2002019045 (2002-01-01), None
patent: WO 00/26973 (2000-05-01), None

Affiliated with

Also associated with

Rating

Material for packaging electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Material for packaging electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Material for packaging electronic components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3643547