Material for a housing of electronic components

Details Material for a housing of electronic components Material for a housing of electronic components

1989-10-27

1992-06-30

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

252506, 252503, 252507, 252518, 252519, 252520, 524495, 524496, 524431, 524435, 524408, 524413, 524401, 523513, 523514, 523515, 523516, H01B 106, C08J 340, C08J 322

Patent

active

051260751

ABSTRACT:
Material for a housing of electronic components, a compound of synthetic resin, which contains ferrite powder and carbon fiber, is bestowed with original properties of the synthetic resin, such as lightness and freedom of molding, high permeability brought by ferrite powder, and high conductivity and mechanical properties by a designated carbon fiber. The material is made into a light housing with various shapes by injection molding or vacuum molding. The housing concentrates on its surface magnetic flux from external low-frequency field and shields the electronic components from electromagnetic wave noise and low-frequency magnetic field, preventing electromagnetic troubles of the electronic components.

REFERENCES:
patent: 4816184 (1989-03-01), Fukuda et al.

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