Material deposition masking for microcircuit structures

Details Material deposition masking for microcircuit structures Material deposition masking for microcircuit structures

1975-07-28

1977-03-08

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

118505, 204192R, 427282, C25D 502, C25D 712

Patent

active

040111431

ABSTRACT:
To minimize the deposition of materials in portions of a microcircuit structure beyond those intended to be deposited upon through openings in a mask, a special mask holding arrangement is used. This arrangement can be used with several deposition methods which include sputtering and evaporation as well as supplementing these with plating techniques.

REFERENCES:
patent: 3170810 (1965-02-01), Kagan
patent: 3408271 (1968-10-01), Reissmueller et al.
patent: 3479269 (1969-11-01), Byrnes, Jr. et al.
patent: 3609472 (1971-09-01), Bailey

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