Material composition for packaging of light-sensitive...

Details Material composition for packaging of light-sensitive... Material composition for packaging of light-sensitive...

2004-02-27

2009-10-06

Tran, Binh X (Department: 1792)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S096200, C427S097500, C523S403000

Reexamination Certificate

active

07597928

ABSTRACT:
The invention pertains to a material composition for packaging. The composition comprises (a) an epoxy resin and (b) a curing agent, wherein the mixing ratio of said epoxy resin to said curing agent is in the range of from 0.7 to 1.1. The invention also pertains to a method of using said material composition for packaging a light-sensitive component on a substrate.

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patent: 2002/0089071 (2002-07-01), Sumita et al.
patent: 2003/0071368 (2003-04-01), Rubinsztajn
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patent: ROC 501244 (2002-09-01), None
patent: ROC 503574 (2002-09-01), None

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