Material board for producing hybrid circuit board with...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S250000, C174S255000, C174S260000, C174S262000, C174S535000, C361S777000, C361S784000, C029S846000, C029S592000, C029S825000

Reexamination Certificate

active

07943860

ABSTRACT:
A material board for producing a hybrid circuit board includes a plurality of hybrid circuit board sections1on each of which an electronic component2is mounted and a metallic terminal plate3for external connection is bonded so as to project from the hybrid circuit board section. A frame portion6is defined between the hybrid circuit board sections, and the hybrid circuit board sections are integrally connected to the frame portion via a thin strip8provided at an intermediate portion of grooves7each surrounding a respective one of the hybrid circuit board sections entirely. In bonding the terminal plate3to the hybrid circuit board by soldering, the terminal plate is temporarily bonded to the frame portion 6 with an adhesive9. The adhesive is prevented from spreading toward the end of the terminal plate. A hole or a recess10is formed in the frame portion6at a region with which the terminal plate3is to overlap and which is closer to an end of the terminal plate than a portion to which the adhesive9for temporarily bonding the terminal plate to the frame portion is to be applied is.

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