Material and method for three-dimensional modeling

Details Material and method for three-dimensional modeling Material and method for three-dimensional modeling

2005-03-22

2005-03-22

Tentoni, Leo B. (Department: 1732)

Plastic and nonmetallic article shaping or treating: processes

Direct application of electrical or wave energy to work

Microwave

C264S308000, C264S317000, C264S234000, C525S461000

Reexamination Certificate

active

06869559

ABSTRACT:
The present invention is a modeling technique wherein a three-dimensional model and its support structure are built by fused deposition modeling, using a thermoplastic blended material containing a polyphenylsulfone (PPSF) polymer and a polycarbonate (PC) polymer to form the model. The PPSF/PC blend exhibits good chemical resistance, thermal stability, and resists build-up in the nozzle of a three-dimensional modeling apparatus. Removal of the support structure from a completed model is facilitated by operating on the material while it is hot.

REFERENCES:
patent: 4152367 (1979-05-01), Binsack et al.
patent: 5503785 (1996-04-01), Crump et al.
patent: 6127492 (2000-10-01), Nagashima et al.
patent: 20010030383 (2001-10-01), Swanson et al.
patent: 20020017743 (2002-02-01), Priedman, Jr.
patent: WO 0078519 (2000-12-01), None

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