Material and method for planarization of substrate

Stock material or miscellaneous articles – Composite – Of silicon containing

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428450, 428901, 528 33, 528 43, B32B 904

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active

059767030

ABSTRACT:
A material and a method for planarizing an uneven surface of a substrate, such as those used for making wiring boards and electronic devices and having broad patterns on their surfaces, are provided. The material is a polysilphenylenesiloxane or a copolymer of polysilphenylenesiloxane with an organosiloxane, and is applied to an uneven surface of a substrate, and then heated to be reflowed to thereby be formed into a planarized film or layer. The material allows a substrate containing wiring having a width of up to several hundred micrometers to be planarized.

REFERENCES:
patent: 2445794 (1948-07-01), Marsden
patent: 4172169 (1979-10-01), Mawson et al.
patent: 4233427 (1980-11-01), Bargain et al.
patent: 4331733 (1982-05-01), Evans et al.
patent: 4778871 (1988-10-01), Newhouse et al.
patent: 5035927 (1991-07-01), Chen et al.
patent: 5240813 (1993-08-01), Watanabe et al.
patent: 5484687 (1996-01-01), Watanabe et al.

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