Matching unit for semiconductor plasma processing apparatus

Details Matching unit for semiconductor plasma processing apparatus Matching unit for semiconductor plasma processing apparatus

2006-11-07

2006-11-07

Vo, Tuyet Thi (Department: 2821)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S298010, C156S345440, C156S345470, C156S345480, C118S7230IR

Reexamination Certificate

active

07132040

ABSTRACT:
This matching unit is used for a semiconductor plasma processing apparatus supplying high-frequency power via feeding line to an electrode provided in a chamber, and includes first and second variable capacitors, and a distributed constant circuit, which is structured by copper plates connected between an electrode of the second variable capacitor and an end of an internal conductor of the feeding line and the like. The distributed constant circuit and the feeding line delay the phase of a high-frequency voltage by ½ wavelength. Therefore, the same state as those when the electrode of the second variable capacitor and the electrode inside the chamber are directly connected can be realized, and matching is easily attained.

REFERENCES:
patent: 5077499 (1991-12-01), Oku
patent: 2002/0134508 (2002-09-01), Himori et al.
patent: 07-159562 (1995-06-01), None

Affiliated with

Also associated with

Rating

Matching unit for semiconductor plasma processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Matching unit for semiconductor plasma processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Matching unit for semiconductor plasma processing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3660757