Wave transmission lines and networks – Coupling networks – With impedance matching
Patent
1990-08-03
1991-12-24
Gensler, Paul
Wave transmission lines and networks
Coupling networks
With impedance matching
333161, 333247, H01P 508
Patent
active
050756451
ABSTRACT:
In a matching circuit for a high-frequency transistor, using a microstrip line for the main line and having a high-frequency transistor side main line shaped in a taper form, a thin-film capacitor and a grounding circuit are disposed between the taper part and the ground. The length of the parts of the thin-film capacitor is different in the signal traveling directions or the shape of the grounding circuit is different so that the impedance is matched at the output position of the thin-film capacitor part, while the spatial phase difference of high-frequency signals can be compensated at the same time.
REFERENCES:
patent: 3419813 (1968-12-01), Kamnitsis
patent: 4272731 (1981-06-01), Day et al.
"Microwave Integrated-Circuit Technology-A Survey", IEEE Journal of Solid-State Circuits, vol. SC-5, No. 6, Dec. 1970, pp. 292-303.
"Broad-Band Internal Matching of Microwave Power GaAs MESFET's", IEEE Transactions of Microwave Theory and Techniques, vol. MTT-27, No. 1, Jan. 1979, pp. 3-8.
Eda Kazuo
Miwa Tetsuji
Taguchi Yutaka
Gensler Paul
Matsushita Electric - Industrial Co., Ltd.
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