Matched low dielectric constant, dimensionally stable adhesive s

Details Matched low dielectric constant, dimensionally stable adhesive s Matched low dielectric constant, dimensionally stable adhesive s

1995-04-07

1997-07-29

Cannon, James C.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

1563077, 174259, 174138G, 428349, 428354, 428422, 428901, H05K 102, H05K 346

Patent

active

056520557

ABSTRACT:
The present invention is an improved adhesive sheet (also known as a "bond ply," "bond film," or "prepreg") material suitable for bonding together electric circuit boards and other electrical components. The adhesive sheet of the present invention comprises a combination of a porous expanded polytetrafluoroethylene (PTFE), a ceramic filler, and a thermoset resin imbibed within the porous PTFE structure. By employing a fill of less than about 60% by weight of resin, the adhesive sheet has exceptionally good performance characteristics while being vastly easier to process.

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