Matched-impedance high-bandwidth configuration jumper

Wave transmission lines and networks – Coupling networks – With impedance matching

Reexamination Certificate

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Details

C174S261000, C333S004000, C333S005000

Reexamination Certificate

active

11146316

ABSTRACT:
The present invention provides a matched-impedance jumper that is operable to connect pairs of differential signal conductors to provide improved signal transmission characteristics. In an embodiment of the invention, the impedance-matched jumper is used to connect a first pair of differential signal conductors to a selected pair of differential signal conductors selected from a plurality of second pairs of differential signal conductors. The impedance-matched jumper comprises a plurality of input pins that are operable to connect with a plurality of connection pads on the first pair of differential signal conductors and a plurality of output pins operable to connect with a plurality of connection pads on the predetermined second pair of differential signal conductors. A plurality of internal conductors are operably connected to the input pins and the output pins to define a signal path therebetween. The signal path defined by the input pins, the output pins, and the internal conductors provides an impedance-matched passthrough for differential signals.

REFERENCES:
patent: 6265952 (2001-07-01), Kan
patent: 2004/0196062 (2004-10-01), Fuller et al.
“Board Design Guidelines for PCE Express™ Interconnect,” PCI-SIG Developers Conference, Intel corporation, http://www.hep.ph.ic.ac.uk/calice/elecLongterm/040728ucl/PCI—Express—PCB—Guidelines.pdf, printed Oct. 19, 2005.
“Impedance Matching,” Throughput Solutions, http://www.adc.com/krone/literature/brochures/bro—imp.pdf, printed Oct. 19, 2005.
“The Many Flavors of LVDS,” National Semiconductor, http://www.national.com
ationaledge/feb02/flavors.html, printed Oct. 19, 2005.
“An Overview of LVDS Technology,” National Semiconductor Corporation, Jul. 1998 http://www.national.com/an/AN/AN-971.pdf#page=1, printed Oct. 19, 2005.
D. Lewis, “LVDS: Five Tips for Buffering Signal Integrity,” Communications Design China—Conference Proceedings, http://www.eetasia.com/ARTICLES/2001AUG/2001AUG09—RFD—EDA—TAC.PDF, printed Oct. 19, 2005.
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